Topological and Parametric Optimization of DC-iEK Devices

The Problem

Engineering work centered on electrokinetic microfluidic device optimization through FEM in COMSOL, aiming to reduce Joule heating while preserving field intensity and electrokinetic performance.

How We Solved It

Filleted geometries were introduced and operating voltage was reduced from 2500 V to 1500 V to lower average temperature and dissipated power without compromising functional behavior.

Key Results

• 27% reduction in average fluid temperature.
• 40% reduction in dissipated power.
• Maximum electric field: 1.6×10^6 V/m.
• Average operating temperature reduced to 23 °C.
• Optimized geometry aligned with experimental validation.